High Performance Electronic Potting Compound

HONG YE SILICONE Electronic Potting Compound, also called Silicone Encapsulant, is a premium liquid silicone material with waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. It cures solid after mixing with a curing agent, offering excellent adhesion to PC, PMMA, PCB and CPU. Available in addition and condensation curing types, it works stably from -60℃ to 220℃. This product complements our core lines like RTV 2 Silicone Rubber, Pad Printing Silicone and Food Grade Mold Silicone, delivering reliable protection for global electronic manufacturers.      Product Overview Our Electronic Potting Compound is a high-performance silicone-based encapsulation adhesive designed for sealing, filling and protecting electronic components. Mixed with a curing agent, the liquid turns into a solid protective layer that shields components from moisture, dust, corrosion and vibration. Compatible with PC, PMMA, PCB and CPU, it ensures superior adhesion and therm…